Dscoop Emea

June 2017 – Lyon, France

Dscoop is a community that delivers the promises of digital print to create tomorrow’s customers today. We bring together Print Service Providers (PSPs) and converters to share new skills and strategies. We offer our members training, tools and networking opportunities so that together, we can innovate print.

In the conference Gil Horsky will speak about the major consumer trends that will revolutionize the retail and FMCG industry by 2020.

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INNOVAtion FOOD INDUSTRY CONFERENCE

June 2017  – Galilee, Israel

The Tel Hai Academic College in the Galilee, that is located in Northern part of Israel will host it’s annual food industry conference with this year’s theme focused on “Innovation in the Food Industry – Technology Meets Health & Wellness” focusing on the link between the food industry and academic research in the field.
In the conference, Horsky will lecture about global trends in the food industry, and then will facilitate a panel about innovation in the food industry and the linkage between academia and industry.

Other participants in the panel facilitated by Horsky will include Amir Zaidman from The Kitchen, Michal Drayman from JVP and Dr. Ofir Benjamin from Tel Hai College.
At the end of the conference students from the food science program in the Tel-Hai Academic College will showcase their final projects and the participating speakers, including Horsky, will feedback on them

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 PACKAGING THAT SELLS CONFERENCE

October 2017  – Chicago, USA

BRANDPACKAGING’s Packaging That Sells is an influential packaging conference for brand marketers and package design teams who understand the vital role packaging plays in delivering a brand’s message & connecting with consumers.

In this conference Gil Horsky will present the Keynote about Packaging First Innovation. Horsky’s innovation agenda on some of the world’s most iconic chocolate brands is driven by the belief that the innovation process should begin with the packaging, followed by other elements of the overall proposition. He’ll share with us real-life examples of his “Packaging First Innovation” approach.

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 Global Innovation Forum

gil-horsky-gloabl-innovation-forum

November 2017 – London, UK

The forum will bring together innovators, entrepreneurs and inventors to discuss the latest trends in innovation, design, creativity, R&D and new product development. You can expect a tremendous agenda, experienced speakers, key messages, global players and intense networking.

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